5G Network slicing
Senthil Kumar Subramani, Senthil has significant experience in wireless (3G, 4G, 5G NR) and cloud technologies and held leadership roles in pre/post-sales, engineering, and product management. He has worked in notable companies such as Intel (Munich), Qualcomm (UK), Sony Mobile (Sweden), Airspan Communications (UK), and Three UK. Senthil started his wireless career at Sasken, where he worked on 3G Access Stratum Protocol stack development and collaborated with NXP, France in delivering solutions to Samsung. He then spent nearly 8 years at Qualcomm UK in the Customer Engineering division, commercializing Snapdragon chipsets for Tier-1 OEMs in Europe. Later, he gained experience in Radio Access Network (RAN), small cells, and Android while working at Airspan Communications and Three UK. He is a member of Development Co-ordination Committee(DCC), Standards preparation for telecom equipment, TEC, Department of Telecommunications, India. Additionally, Senthil is an active blogger.
5G Network slicing